Kiru (Cutting), Kezuru (Grinding), Migaku (Polishing)
These three words, Kiru (Cutting), Kezuru (Grinding), Migaku (Polishing), more than any other define the business theme of DAA, Inc. Since the time of ancient man, sophisticated tools for cutting, grinding, and polishing were needed in order to support the lifestyles of the people.
At DAA, Inc., we are committed to supplying diamond tools, used for cutting, grinding, and polishing, to the construction and stone markets utilizing the best technology available. Our primary goal is to offer the best performance for every tool.
Disco Corp., our parent company is located in Tokyo, Japan, and has been a world leader in the manufacturing of diamond tools as well as precision machines for 7 decades. Disco is a major supplier to the Semi-conductor industry, supplying them with 80% of the ultra thin blades (25 micron thick) used for dicing and slicing silicon wafers. We are also the world's leader in technology for the equipment used to slice, dice, and grind the silicon wafers. You can imagine the attention to quality that goes into making these products. The same people, who make the products for the Semi-conductor market, also make the products we supply to the construction and stone markets.
DAA, Inc. offers the right solution for all Kiru (Cutting), Kezuru (Grinding), and Migaku (Polishing) applications. We accomplish this through Abrasive Technology ( extensive Research and Development effort), Machine Equipment Technology ( either through manufacturing the equipment ourselves, like we do for the Semi-conductor market, or through a very close alliance with the major OEM's in other markets), and Application Technology (over 70 years of experience). We offer the best solution for our customers, and if we do not have the answer today, we will work as hard as possible to find it. Our customer's success is our success. By working together, we will be sure to reach our mutual goals.
