DDA, Inc. Mission
Kiru
(Cutting), Kezuru (Grinding), Migaku (Polishing)
These
three words, Kiru (Cutting), Kezuru (Grinding), Migaku (Polishing), more
than any other define the business theme of DAA, Inc. Since the time of
ancient man, sophisticated tools for cutting, grinding, and polishing
were needed in order to support the lifestyles of the people.
At
DAA, Inc., we are committed to supplying diamond tools, used for
cutting, grinding, and polishing, to the construction and stone markets
utilizing the best technology available. Our primary goal is to offer
the best performance for every tool.
Disco
Corp., our parent company is located in Tokyo, Japan, and has been a
world leader in the manufacturing of diamond tools as well as precision
machines for 7 decades. Disco is a major supplier to the Semi-conductor
industry, supplying them with 80% of the ultra thin blades (25 micron
thick) used for dicing and slicing silicon wafers. We are also the
world's leader in technology for the equipment used to slice, dice, and
grind the silicon wafers. You can imagine the attention to quality that
goes into making these products. The same people, who make the products
for the Semi-conductor market, also make the products we supply to the
construction and stone markets.
DAA,
Inc. offers the right solution for all Kiru (Cutting), Kezuru
(Grinding), and Migaku (Polishing) applications. We accomplish this
through Abrasive Technology ( extensive Research and Development
effort), Machine Equipment Technology ( either through manufacturing the
equipment ourselves, like we do for the Semi-conductor market, or
through a very close alliance with the major OEM's in other markets),
and Application Technology (over 70 years of experience). We offer the
best solution for our customers, and if we do not have the answer today,
we will work as hard as possible to find it. Our customer's success is
our success. By working together, we will be sure to reach our mutual
goals.
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